Samsung, Qualcomm Cut AI Chip Costs with New Tech

Samsung and Qualcomm have joined forces to pioneer a novel "organic bridge" technology, set to revolutionize AI chip manufacturing. This innovative approach is being developed for 2.1D packaging, a cost-effective alternative to the conventional 2.5D integration methods that rely on silicon, glass, or ceramic interposers.

The "organic bridge" utilizes layers made from resin or polymer, drawing inspiration from printed circuit board manufacturing. This method not only slashes production costs but also enhances assembly efficiency and mitigates supply chain challenges associated with silicon. The technology aims to improve bandwidth while providing essential insulation between microcircuit dies.

This advancement comes at a critical time, as the demand for AI data centers continues its rapid expansion. The 2.1D packaging could be instrumental in realizing the full potential of artificial intelligence by addressing the significant cost and energy demands inherent in AI processing. Samsung's collaboration extends beyond Qualcomm, with other industry partners also showing interest in adopting this new packaging standard.

While the development, including patent filings around October 2024, has been ongoing for about a year, it may take some time before production-ready AI chips featuring 2.1D packaging become widely available. Competitors like Intel and TSMC are also exploring similar 2.1D packaging solutions, indicating a broader industry shift towards more efficient and affordable AI chip fabrication.