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Samsung & ASML: Powering AI Chip Future
8 Sep
Summary
- Samsung will adopt 12-inch photomask technology for advanced chip manufacturing.
- Samsung plans to introduce ASML's High NA EUV lithography by 2028.
- Partnership aims to accelerate AI and semiconductor innovation for future chips.
Samsung Electronics and ASML are deepening their collaboration to advance semiconductor manufacturing technologies, particularly for the burgeoning AI era.
Samsung will adopt 12-inch photomask technology, a significant upgrade from the decades-old 6-inch format, to boost fab productivity and reduce costs for future chip generations.
This strategic move also includes Samsung's plan to integrate ASML's High NA EUV lithography into its DRAM high-volume manufacturing by 2028, becoming an industry first. This advanced technology is expected to extend DRAM scaling and improve process efficiency.
The partnership signifies a joint commitment to innovation and technological leadership, aiming to lay the groundwork for next-generation AI and semiconductor advancements through enhanced memory and foundry capabilities.
