What is Frore Systems' LiquidJet technology?

LiquidJet is Frore Systems' advanced coldplate solution that uses a multistage cooling architecture with a 3D short-loop jetchannel structure to dissipate high amounts of heat from GPUs.

How does Frore Systems' AirJet Mini G2 compare to traditional fans?

The AirJet Mini G2 is a solid-state cooler with no moving parts, offering higher back pressure, quieter operation (21 dBA), and a compact design, unlike traditional fans.

What are the future capabilities of Frore Systems' cooling solutions?

Frore Systems' LiquidJet coldplate is designed to be future-proof, capable of cooling chips up to the 4400-watt class, including NVIDIA's future Feynmann GPUs.

Home / Technology / Frore Systems Cools NVIDIA's Next-Gen GPUs

Frore Systems Cools NVIDIA's Next-Gen GPUs

9 Jan

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Summary

LiquidJet offers 1950W TDP cooling for NVIDIA's Rubin GPUs.
AirJet Mini G2 provides improved heat dissipation in compact devices.
Frore's cooling solutions are future-proofed for upcoming high-wattage chips.

Frore Systems Cools NVIDIA's Next-Gen GPUs

Frore Systems demonstrated its innovative LiquidJet coldplate technology, capable of providing up to 1950W TDP cooling for NVIDIA's upcoming Rubin GPUs. This multistage cooling solution utilizes a 3D short-loop jetchannel structure and can be customized for various GPU power requirements, offering a significant advancement over existing data center cooling methods.

The company showcased multiple use cases at CES, including a setup that achieved 600W/cm2 over a GPU hotspot, maintaining a junction temperature of 94.1°C. Another impressive demo featured the LiquidJet cooling an NVIDIA Rubin GPU with an 8x HBM solution, keeping the chip temperature at 80.5°C. Frore Systems assures that their LiquidJet is designed to handle chips up to the 4400-watt class.

In addition to the LiquidJet, Frore Systems also featured their AirJet Mini G2 solid-state cooler in partner systems, such as a Qualcomm Snapdragon X2 Elite notebook. This compact cooler offers enhanced heat dissipation, increased back pressure for dust and water resistance, and silent operation, making it ideal for ultra-compact and portable devices.