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China's Chip Dream: National Push for Lithography Systems
5 Mar
Summary
- Top executives urge national resource pooling for lithography development.
- China aims for self-reliant lithography systems by 2026-2030.
- Key areas needing coordination include EDA software and materials.
Top Chinese semiconductor executives have advocated for a synchronized national effort to develop functional lithography systems between 2026 and 2030. This initiative underscores China's commitment to enhancing its technological independence.
These leaders, including those from Naura Technology Group and Empyrean Technology, co-authored an article stressing the importance of consolidating national resources. They proposed integrating breakthroughs from various institutions to overcome development hurdles.
The article pointed to the intricate nature of lithography machines, citing ASML's EUV equipment as an example of complex integration. It called for China to create its own equivalent by allocating funds and human resources effectively.
Progress has been made in specific components like EUV laser light sources, but system integration remains a significant challenge for the 15th five-year plan. Bottlenecks in electronic design automation (EDA) software and essential materials like silicon wafers and electronic gases were also identified as areas requiring national coordination.
Semiconductors have been designated a core pillar of China's nascent industry. While China holds a substantial share of global chip production capacity at mature nodes, achieving leadership in advanced technology requires overcoming these integration and development challenges.
