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Apple's New Chip Design Sparks Performance Leap
7 Feb
Summary
- New M5 Pro/Max chips may use custom SoIC-MH layout for better scalability.
- This architectural change could improve efficiency and battery life.
- Future chips might decouple CPU and GPU performance for cost control.
Apple is rumored to be adopting a new chip architecture for its upcoming M5 Pro and M5 Max processors, moving away from the current system-on-chip design.
This shift involves utilizing TSMC's system-on-integrated-chip molding-horizontal (SoIC-MH) layout. This approach fabricates operational groups on separate chiplets, which are then interconnected within a single package, potentially including memory.
The primary advantage anticipated is improved scalability, particularly for graphics and AI processing. By dedicating a separate chiplet to the GPU, Apple can more easily increase its power independently of the CPU.
This architectural evolution could also lead to reduced heat generation and extended battery life. Furthermore, decoupling CPU and GPU performance might offer consumers more flexible and cost-effective configuration choices for future MacBook Pros.
These new M5 Pro and Max systems are anticipated to debut around the Worldwide Developers Conference, signaling Apple's renewed focus on gaming and AI capabilities for developers.
