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Malaysia Aims for Chip Design Prowess
16 Oct
Summary
- Malaysia is transitioning from chip packaging to product development.
- The nation seeks to create commercially viable, scalable semiconductor products.
- This move targets higher-value segments within the global semiconductor industry.
Malaysia is actively pursuing a strategic evolution within the global semiconductor landscape. The country is endeavoring to transcend its traditional strengths in chip packaging and testing services.
This initiative centers on developing Malaysia's capacity for creating its own commercially viable semiconductor products. The ultimate goal is to achieve large-scale production and sales.
By targeting higher-value segments of the industry, Malaysia seeks to enhance its contribution to the global technology supply chain and foster greater innovation within its borders.
Disclaimer: This story has been auto-aggregated and auto-summarised by a computer program. This story has not been edited or created by the Feedzop team.
