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Home / Business and Economy / AI Chip Firm Axera Aims for $379M Hong Kong IPO

AI Chip Firm Axera Aims for $379M Hong Kong IPO

31 Jan

•

Summary

  • Axera plans to raise HK$2.96 billion in a Hong Kong IPO.
  • Proceeds will fund technology upgrades and product development.
  • The company focuses on AI inference chips for on-device computing.
AI Chip Firm Axera Aims for $379M Hong Kong IPO

Chinese artificial intelligence chipmaker Axera Semiconductor is preparing for a significant initial public offering in Hong Kong, aiming to raise HK$2.96 billion ($379.2 million). This capital infusion is strategically planned for upgrading its technology, developing innovative products, and expanding its market reach.

Founded in 2019, Axera designs fabless chips crucial for AI inference, particularly for on-device computing and smart vehicles. These processors enable real-time visual data processing in devices like cameras and cars. The company positions itself as a global leader in mid-to-high-end visual on-device AI inference chips.

Despite a reported revenue increase of 5.8% to 269.0 million yuan for the first nine months of 2025, Axera experienced a net loss widening to 855.7 million yuan during the same period. The IPO proceeds will also support potential investments and acquisitions.

The offering comes as Chinese AI and semiconductor firms increasingly look to Hong Kong for funding to fuel capital-intensive chip development and meet the growing demand for on-device AI processing.

Disclaimer: This story has been auto-aggregated and auto-summarised by a computer program. This story has not been edited or created by the Feedzop team.
Axera Semiconductor is aiming to raise HK$2.96 billion ($379.2 million) in its initial public offering in Hong Kong.
The proceeds will be used for upgrading its technology platform, developing new products, sales expansion, potential investments or acquisitions, and general corporate purposes.
Axera Semiconductor designs fabless AI inference system-on-chips used in on-device computing, edge inference, and smart vehicles.

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