Home / Business and Economy / Besi Shares Dip Amid ASML Hybrid Bonding Threat
Besi Shares Dip Amid ASML Hybrid Bonding Threat
16 Oct
Summary
- ASML reportedly developing hybrid bonding tools, challenging Besi.
- Besi leads in advanced hybrid bonding for 3D chips.
- Market sees packaging as next frontier for chip performance gains.
BE Semiconductor Industries (Besi) saw its shares decrease by 3% on Friday, trading at €158.50. This downturn followed a report from SemiAnalysis alleging that semiconductor giant ASML is developing hybrid bonding products. Hybrid bonding is an advanced packaging technology essential for creating next-generation three-dimensional chips.
Besi, a smaller entity compared to ASML, currently holds a leading position in this critical technology. ASML, the primary manufacturer of semiconductor production equipment, has not officially confirmed plans for such a tool. However, the company did highlight its launch of an advanced packaging tool last year and its ongoing assessment of industry evolution.
Industry observers believe that advanced packaging represents a significant frontier for unlocking further performance gains in semiconductors. ASML's potential entry into this space is seen as vital for supporting its growth projections and justifying its current valuation. Besi's stock performance reflects investor reaction to the potential increased competition.
