Home / Technology / TSMC Unveils New Chip Tech, Skips Costly ASML Upgrades
TSMC Unveils New Chip Tech, Skips Costly ASML Upgrades
23 Apr
Summary
- TSMC revealed new chip technologies, A13 and N2U, for production starting 2029.
- The company plans to leverage existing EUV machines, avoiding expensive new ASML hardware.
- New chip-stitching technology could enable more powerful AI processors by 2028.
Taiwan Semiconductor Manufacturing Co. (TSMC) recently demonstrated its next-generation chip manufacturing technologies, A13 and N2U. These advancements are expected to be integrated into production starting in 2029, with potential applications in artificial intelligence, phones, and laptops. A key strategy involves maximizing gains from existing extreme-ultraviolet lithography (EUV) machines sourced from ASML, thereby avoiding the substantial investment in newer, more expensive 'high NA' EUV machines.
TSMC's approach focuses on extending the capabilities of its current EUV technology. This strategy allows for continued progress in chip scaling without the immediate need for new, costly hardware. Analysts suggest that TSMC's efforts in stitching multiple chips together could be crucial for future performance gains, particularly in AI applications. By 2028, the company aims to connect up to 10 large chips and 20 memory stacks.
This multi-chip stitching approach is seen by some as a modern interpretation of Moore's Law, enabling power and performance improvements. However, challenges such as heat dissipation and material expansion differences in these complex packages require careful management by chip designers. Issues like bending and cracking in large chip packages have been noted in previous AI processor developments.
