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TSMC to Build Advanced Chip Packaging Plant in Arizona by 2029
23 Apr
Summary
- TSMC will construct a new chip packaging plant in Arizona.
- The facility is slated for completion by 2029.
- This plant will utilize advanced CoWoS and 3D-IC packaging technologies.
Taiwan Semiconductor Manufacturing Co. has begun construction on a new advanced chip packaging plant in Arizona, aiming for completion by 2029. This facility will incorporate highly sought-after CoWoS and 3D-IC packaging technologies, essential for producing sophisticated artificial intelligence chips.
The expansion in Arizona is a strategic move to enhance TSMC's manufacturing footprint within the United States. While Apple and Nvidia already source chips from TSMC's Arizona factory, many components require further processing, including advanced packaging, which is currently done in Taiwan.
