SK Hynix Seeks US Chip Export Deal for China Factory

SK Hynix is actively seeking Washington's approval to export advanced US semiconductor equipment to its Dalian, China facility. This critical export license is directly linked to SK Hynix's pledge to construct a new NAND flash memory chip factory within the United States. The company's US-based unit, Solidigm, aims to boost production in Dalian, which utilizes equipment from major American suppliers. This strategy is intended to help finance and facilitate the development of a new NAND facility in the US.

Last year, the Commerce Department revised export control policies for Chinese chip facilities, revoking previous exemptions. While existing operations were allowed, expansion or technology upgrades faced stricter licensing requirements. SK Hynix's Dalian site, specifically a facility known as Mod B built in 2023, has space for additional equipment. Solidigm has applied for export licenses for more tools to outfit this space, with the Commerce Department yet to issue a 2027 license. SK Hynix is also exploring other US investments, including talks with Intel for a facility in Ohio and developing an advanced packaging plant in Indiana.