Home / Technology / Quectel Unveils Next-Gen IoT Modules with Qualcomm Chipset
Quectel Unveils Next-Gen IoT Modules with Qualcomm Chipset
10 Nov
Summary
- New modules offer cost and power efficiency for IoT devices.
- EG216Q-GL provides LTE Cat 1bis for telematics and payment terminals.
- BG950Q-GL offers ultra-low power for battery-operated IoT devices.
Quectel Wireless Solutions has introduced two new global cellular IoT modules, the EG216Q-GL and BG950Q-GL, developed with Qualcomm technology. These modules are designed to provide IoT device manufacturers with a more cost-effective and power-efficient upgrade pathway from their established legacy platforms.
The EG216Q-GL is an LTE Cat 1bis module, sharing a form factor with Quectel's existing EG2-footprint modules. This allows for seamless upgrades for applications such as commercial telematics, payment terminals, and asset tracking, delivering up to 10 Mbps downlink speeds.
The BG950Q-GL is an ultra-low-power LTE Cat M1/Cat NB2 module, compatible with Quectel's BG95 series and other LPWA modules. Its design is optimized for devices requiring extended battery life, including smart meters, wearables, and wireless POS terminals.
These new modules aim to help customers maintain their existing board designs and development investments while benefiting from improved performance and reduced operational costs. Industry forecasts indicate a significant growth in Cat 1bis technology, positioning these modules for future market demands.
