Home / Technology / nVent, AMD Forge AI Cooling Alliance
nVent, AMD Forge AI Cooling Alliance
13 Oct
Summary
- nVent's cooling tech integrates with AMD's AI platform.
- New solution targets large AI workloads at rack scale.
- The integrated system will be shown at OCP Global Summit.
nVent and AMD have announced a significant collaboration to integrate advanced cooling solutions into AMD's Helios rack-scale AI platform. This partnership aims to provide a fully integrated system capable of handling demanding large-scale AI workloads.
The collaboration will incorporate nVent's rear door heat exchanger (RDHx) technology into the AMD Helios infrastructure. This platform already features AMD Instinct GPUs, EPYC CPUs, Pensando networking, and the ROCm software stack.
This integrated cooling solution is designed for efficiency, managing heat effectively to maintain optimal operating temperatures for AI hardware. It allows for scalability, enabling operators to start with single racks and expand to larger deployments.
A first look at this combined system will be presented by nVent and AMD at the OCP Global Summit in San Jose, California, taking place from October 12 to October 16, 2026. Attendees can find more information at Booth #A9.
