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India's Chip Design Soars: DLI Scheme Fuels Innovation
5 Jan
Summary
- 16 chip tape-outs and six ASIC chips have been fabricated.
- Over 1,000 engineers trained, 140 reusable IP cores developed.
- Scheme aims to boost volume manufacturing and market deployment.

India's Design Linked Incentive (DLI) scheme, launched in December 2021, is demonstrating significant success in cultivating a competitive semiconductor design ecosystem. The program has facilitated the completion of 16 chip tape-outs and the fabrication of six ASIC chips, alongside spurring 10 patents and developing over 140 reusable IP cores.
With a focus on supporting the full lifecycle of semiconductor design, the DLI scheme has sanctioned 24 projects across diverse areas like satellite communications and IoT SoCs. It has also provided access to industry-grade EDA tools for 95 companies and benefited approximately 1 lakh engineers and students nationwide.
The scheme is now strategically shifting its focus to productization, aiming to empower startups and MSMEs to scale up to volume manufacturing and system integration. This initiative underscores the growing importance of fabless chip design, where design and IP contribute significantly to a product's economic value.




