Home / Technology / Cadence Launches AI Agent for PCB and Chip Design
Cadence Launches AI Agent for PCB and Chip Design
16 Jul
Summary
- Cadence introduced AuraStack, an AI agent for designing circuit boards and chip packages.
- The tool uses plain language descriptions to automate engineering tasks, potentially halving time to market.
- Nvidia chips will accelerate AuraStack's AI capabilities, with early users including Nvidia and TSMC.
Cadence Design Systems has unveiled AuraStack, an advanced artificial-intelligence agent that automates the complex design processes for printed circuit boards and chip packages. Engineers can now describe their design objectives using simple, natural language. AuraStack then independently plans and executes the work, leveraging Cadence's existing software suite for layout and virtual testing.
This new AI-powered tool is expected to dramatically accelerate product development, potentially reducing time-to-market by as much as 50%. Cadence also projects a significant increase in productivity for individual engineering tasks, up to 15-fold. This follows similar AI introductions by Cadence earlier this year, aimed at speeding up chip design itself.
Nvidia chips are integrated to enhance the AI's performance. Early adopters of AuraStack include prominent companies such as Nvidia, Taiwan Semiconductor Manufacturing Co., and Schneider Electric. Cadence indicates that customers can integrate AuraStack with various AI models, including those from OpenAI, Google, and Anthropic, or utilize open-source alternatives. Pricing will be consumption-based. AuraStack is slated for a full rollout by September 2026, making advanced AI automation accessible to more engineering teams.
