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Apple's New Chip Design Sparks Performance Leap
7 Feb
Summary
- New M5 Pro/Max chips may use custom SoIC-MH layout for better scalability.
- This architectural change could improve efficiency and battery life.
- Future chips might decouple CPU and GPU performance for cost control.

Apple is rumored to be adopting a new chip architecture for its upcoming M5 Pro and M5 Max processors, moving away from the current system-on-chip design.
This shift involves utilizing TSMC's system-on-integrated-chip molding-horizontal (SoIC-MH) layout. This approach fabricates operational groups on separate chiplets, which are then interconnected within a single package, potentially including memory.
The primary advantage anticipated is improved scalability, particularly for graphics and AI processing. By dedicating a separate chiplet to the GPU, Apple can more easily increase its power independently of the CPU.




