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TSMC Challenges Intel's Packaging Edge
2 Aug
Summary
- TSMC is developing an advanced packaging technology similar to Intel's EMIB.
- Nvidia is evaluating Intel's EMIB for a future processor.
- TSMC's new tech could threaten Intel's competitive advantage in AI chips.
Taiwan Semiconductor Manufacturing Co. is reportedly developing a new chip packaging technology, internally referred to as "EMIB Like." This initiative aims to replicate the functionality of Intel Corp.'s Embedded Multi-die Interconnect Bridge (EMIB) technology. The project is a collaboration between TSMC and Taiwan's Kinsus Interconnect Technology, according to recent reports.
This development emerges amid an intensifying competition in AI chip packaging. Intel has positioned its EMIB technology as a key advantage, enabling the creation of larger, more complex processors with enhanced efficiency and reduced costs. Meanwhile, TSMC currently utilizes its CoWoS packaging for major clients like Nvidia and AMD, with plans to expand this capacity by 2028.
The potential launch of TSMC's EMIB-like technology poses a direct threat to Intel Foundry's established advantage in this critical market segment. This news follows Intel's recent announcement of a partnership with China's Lens Technology to develop advanced semiconductor packaging solutions for future AI and data center chips.
