Paras Defence Enters Semiconductor Arena

Paras Defence and Space Technologies Ltd. has announced the formation of a new subsidiary, Paras Semiconductor Pvt. Ltd. This strategic move signifies the company's expansion into the semiconductor industry, with a specialized focus on advanced packaging technologies essential for defence and strategic applications.

The new entity is set to establish an Outsourced Semiconductor Assembly and Testing (OSAT) facility dedicated to heterogeneous and 3D semiconductor packaging. This state-of-the-art infrastructure will support the development of semiconductor devices crucial for optical and optronic systems in defence and security, alongside demands from high-performance computing, networking, and data centre sectors.

This initiative positions Paras Defence to actively participate in India's growing semiconductor ecosystem, particularly within the defence sector. The company intends to build capabilities in chiplet integration and advanced system-in-package (SiP) technologies, reinforcing national self-reliance and complementing its existing defence electronics expertise.