Home / Business and Economy / India Lands $3.3B Chip Facility
India Lands $3.3B Chip Facility
29 May
Summary
- A $3.3 billion substrate manufacturing facility is coming to India.
- The project will create approximately 1,800 highly skilled jobs.
- The investment marks a significant step for India's chip manufacturing goals.
A significant $3.3 billion investment will establish a new substrate manufacturing facility in India. This landmark project is a collaboration between global technology giants Intel and 3D Glass Solutions, in partnership with the Government of Odisha.
The facility, which will be developed in phases over the next five to six years, is projected to generate approximately 1,800 highly skilled employment opportunities. Its focus on substrate manufacturing is vital for mounting semiconductor chips on motherboards.
This development is a major stride in bolstering India's semiconductor ecosystem and enhancing its domestic chip production capacity. Union Minister Ashwini Vaishnaw lauded the agreement, emphasizing its role in advancing the nation's semiconductor capabilities.
